Selected Publications and Conference Papers (past 5 years)
Yufei Gaoand Peiqi Ge. Analysis of Grit Cut Depth in Fixed-abrasive Diamond Wire Saw Slicing Single Crystal Silicon.Solid State phenomenons. 2011, Vols.175:72-76.
Yufei Gaoand Peiqi Ge. Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal.Applied Mechanics and Materials.2011, Vols.101-102:950-953.
Gao Yufeiand Ge Peiqi. Study on Influences of Electroplating Process Parameters on Compound Coating Quality of Diamond Wire Saw.Diamond & Abrasives Engineering.2011, 31(5):30- 34.
Huang Bo,Gao Yufeiand Ge Peiqi. Study on Surface Defect and Wire Wear Mechanism of Single Crystal Silicon Electroplated Diamond Wire Saw Slicing.Diamond & Abrasives Engineering.2011, 31(1):53- 57.
Yufei Gaoand Peiqi Ge. Experimental Investigation on Brittle-ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon.Key Engineering Materials. 2010.Vols.431-432:265-268.
Gao Yufei, Ge Peiqi and Li Shaojie. Study on the Machining Performance of Single crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw.JOURNAL OF SYNTHETIC CRYSTALS.2009, 38 (2): 372- 377.
Gao Yufei, Ge Peiqi and Li Shaojie. Prediction and Measurement of Subsurface Damage Thickness of Silicon ingot in WireSaw Slicing.China Mechanical Engineering.2009,Vol. 20(14): 1731-1735.
Yufei Gao, Peiqi Ge and Shaojie Li.Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing.Key Engineering Materials.2009,Vols.416:306-310.
Peiqi Ge,Yufei Gao, Shaojie Li and Zhijian Hou. Study on Electroplated Diamond Wire Saw Development and Wire Saw Wear Analysis.Key Engineering Materials.2009,Vols.416:311-315.
Gao Yufei, Ge Peiqi, Zhao Huili and Zhang Lei.Study on Effects of Monocrystalline Silicon Anisotropy on Slicing Quality Using Fixed-abrasive Wire Saw.China Mechanical Engineering.2008 Vol. 19 (22): 2748-2752.
Yufei Gao, Peiqi Ge, and Zhijian Hou. Study on Removal Mechanism of Fixed-abrasive Diamond Wire Saw Slicing Monocrystalline Silicon.Key Engineering Materials. 2008, Vols.359-360:450-454.
|