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your location: Research & Faculty Institute of Mechanical Design and Theory
Yufei Gao


Name: Yufei Gao

Associate Professor, School of Mechanical Engineering, SDU

Deputy Director, Mechanism Design Theory Research Institute


Email: yfgao@sdu.edu.cn


Address: 17923 Jingshi Road, Jinan, China, 250061


A92B

Education

Sept.2004- Dec.2009 Ph.D of Mechanical Engineering, Shandong University

Sept.2008- Aug.2009 Jointly educated Ph.D of Mechanical Engineering,University of Michigan, Ann Arbor, US

Sept.2000-June.2004 Bachelor of Mechanical Engineering, Shandong University


Professional Experience

2010.03 – present Served successively as lecturer and associate professor

School of Mechanical Engineering, Shandong University, China

2010.03 – 2012.05 Post Doctorate

Material Science and Engineering, Shandong University, China


Teaching

Fundamentals of mechanical design

Course design of mechanical design fundamentals

Mechanical comprehensive experiment and innovative design


Special Fields of Interest

Theory and technology of precision wire saw machining for crystal materials

Precision slicing technology of photovoltaic silicon solar cell

Preparation theory and technology of electroplated diamond saw wire and grinding wheel

Mechanical equipment structure and performance analysis design and development

Research Projects

As the project leader, he presided over four national level projects, six provincial and ministerial level projects, three other  level projects, and three enterprise projects.

As the project leader, he has completed: one National Natural Science Foundation  of China ; one special research fund for doctoral programs of the Ministry of education; two China Postdoctoral Research Funds; one open fund for key laboratories of the Ministry of education; one post doctoral innovation fund of Shandong Province; one independent innovation fund of Shandong University; one experimental teaching project of Shandong University.

At present, he is in charge of research: ational Natural Science Foundation of China, key R & D program of Shandong Province, natural science fund of Shandong Province and other national, provincial and ministerial projects, two enterprise projects, and one teaching reform project of Shandong University.

As the main researcher, he participated in one major instrument project of NSFC, three general projects of NSFC, and one natural science foundation of Shandong Province.


Scientific and Professional Societies

Selected Publications and Conference Papers (past 5 years)

[1]Youkang Yin, Yufei Gao*,et al. Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw. Materials Science in Semiconductor Processing, 2020, 106:104779

[2] Xinying Li, Yufei Gao*, et al. Experiment and theoretical prediction for surface roughness of PV polycrystalline silicon wafer in electroplated diamond wire sawing. Journal of Manufacturing Processes, 2020, 49:82-93

[3] Hongshuang Li, Yufei Gao*, et al. Sulfamate nickel pre-plating for preparation of diamond wire saw by electroplating. Electroplating & Finishing, 2019:38(21):1152-1155.

[4] J Pang, Y Gao*, et al. Surface characteristics and wire wear of electroplated diamond wire saw slicing photovoltaic polycrystalline silicon. Diamond & Abrasives Engineering, 2019 : 39(5) : 92-9.

[5] Yufei Gao*, et al. Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal, Materials Science in Semiconductor Processing, 2019, 103:104642

[6] Yufei Gao*, et al. Sawing Stress of SiC Single Crystal with Void Defect in Diamond Wire Saw Slicing. International Journal of Advanced Manufacturing Technology. 2019, 103(1):1019–1031

[7] Xinying Li, Yufei Gao*, et al. Nucleation location and propagation direction of radial and median cracks for brittle material in scratching. Ceramics International, 2019, 45(6):7524–7536

[8] Xinying Li, Yufei Gao*, et al. The Effect of Cut Depth and Distribution for Abrasives on Wafer Surface Morphology in Diamond Wire Sawing of PV Polycrystalline Silicon, Materials Science in Semiconductor Processing, 2019, 91: 316-326

[9] Yufei Gao*, et al. Study on the subsurface microcrack damage depth in electroplated diamond wire saw slicing SiC crystal, Ceramics International, 2018, 44(18):22927–22934.

[10] Hongshuang Li, Yufei Gao*, et al. Analysis of factors affecting the wafer warpage of wire saw. Tool Engineering, 2018:52(12):54-57.


17923 Jingshi Road, School of Mechanical Engineering, Shandong University(Qianfo Campus), 250061
Tel: +86-531-88392239 | Fax: +86-531-88392058 | mech@sdu.edu.cn